Project Name | INGENIOUS - Universal TFLN-InP heterogeneous PIC platform

Grant | CENTRO2030-FEDER-01674300 19231

EU Leading Entity | Lightium AG

Portuguese Leading Entity | PICadvanced, S.A.

Eligible investment (PICADVANCED) | 975,520.00 €

Start Date | 2025-09-01

End Date | 2028-08-31

Main Objective Creation of a streamlined supply chain, based on a single TFLN+InP platform for the development of integrated circuits for its users various applications: AI, optical telecommunications, biomedicine and autonomous vehicles.

Project INGENIOUS is a European industrial R&D project focused on transforming the photonic integrated circuit (PIC) technology ecosystem. The project is developing a novel, universal platform designed to meet the diverse needs of the market — telecommunications, bio-medical sensing and wearable devices, autonomous vehicles, and artificial intelligence — through a single, standardized solution. Combining thin-film lithium niobate (TFLN) technology with Indium Phosphide (InP) lasers and detectors via micro-transfer printing (uTP), INGENIOUS aims to offer better performance, higher reliability and reduced costs when compared to current PIC solutions. PICadvanced, has the main objective to create experimental prototypes that demonstrate the TFLN+InP platform and the process and assembly design kits (PDK/ADK) developed within the project for exploratory transceivers for passive optical network (PON).